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Flexsys™

Flexsys

Scalable microelectronics process and assembly solutions you can grow with.

At ATS, we build high-precision, microelectronics process and assembly systems for advanced packaging, multi-chip modules and optoelectronics. ATS Flexsys™ scalable workcells accommodate multiple operations on a single platform to deliver higher production volumes and dramatically improved yields than conventional technology. With Flexsys™ you get the capability you need today, and the ability to scale up for tomorrow.

ATS Flexsys In cooperation with Lumenon Innovative Lightwave Technology Inc., ATS has developed a Planar Lightwave Circuit Tester. Based on the standard Flexsys 2000, the PLCT is configured to automatically load from Gel-Paks®, align, test and unload Planar Lightwave Circuits.
Flexsys™ 1000 Flexsys™ 2000 Flexsys™ 3000 Flexsys™ 4000
Semi-automated process development and production system Fully automated assembly system High-speed
die bonder
Ultra high-accuracy die bonder
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