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Scalable microelectronics process and assembly solutions you can grow with.
At ATS, we build high-precision, microelectronics process and assembly systems for advanced packaging, multi-chip modules and optoelectronics. ATS Flexsys™ scalable workcells accommodate
multiple operations on a single platform to deliver higher production volumes and dramatically improved yields than conventional technology. With Flexsys™ you get the capability you need today, and the ability
to scale up for tomorrow.
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In cooperation with Lumenon Innovative Lightwave Technology Inc., ATS has developed a Planar Lightwave Circuit Tester. Based on the standard Flexsys 2000, the PLCT is configured to automatically
load from Gel-Paks®, align, test and unload Planar Lightwave Circuits. |
| Flexsys™ 1000 |
Flexsys™ 2000 |
Flexsys™ 3000 |
Flexsys™ 4000 |
| Semi-automated process development and production system |
Fully automated assembly system |
High-speed die bonder |
Ultra high-accuracy die bonder |
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